IMPACT-IAAC 2026 - Energy-Efficient AI: From Computing to Systems and Applications (Taipei)

IMPACT-IAAC 2026 - the 21st International Microsystems, Packaging, Assembly and Circuits Technology Conference - is held on 19-22 October 2026 in Taipei, with the opening day at the Grand Hilai Taipei (19 Oct) and the main sessions at Taipei Nangang Exhibition Center Hall 2 / TaiNEX 2 (20-22 Oct). It is organised by IEEE-EPS, iMAPS Taiwan, ITRI and TPCA, and co-located with the TPCA Show, TAITRONICS and AIoT Taiwan.

The 2026 theme is 'Energy-Efficient AI: From Computing to Systems and Applications', and that framing is central rather than incidental: as AI moves beyond data centres into system-level deployment, performance, power efficiency and reliability increasingly hinge on hardware integration. The technical programme targets the packaging and PCB technologies that make scalable, energy-efficient AI possible - advanced packaging, heterogeneous integration, IC substrates, high-speed/high-frequency PCB, thermal management, reliability, manufacturing processes, materials and sustainability.

For attendees - chip-packaging and hardware researchers, semiconductor and electronics engineers, and AI-infrastructure specialists - the format mixes plenary speeches, an industrial session, special sessions, invited talks and a professional development course. It is a peer-reviewed technical conference (call for papers extended to 30 June 2026) with a strong industry presence thanks to the co-located trade shows, making it a useful bridge between AI-systems research and the manufacturing supply chain that underpins it. Anyone working on the physical foundations of AI compute will find this a focused, in-scope venue.